This cold plate features a pure copper base and bent copper tubing structure, combining excellent thermal conductivity with optimized flow paths. It effectively covers multiple heat source areas (such as dual GPUs or multi-processor layouts) and manages heat efficiently through liquid cooling circulation. The use of copper ensures strong thermal performance, while the design allows easy integration into existing systems.
In industrial applications, as power densities continue to rise, traditional air cooling can face limitations. Liquid cooling solutions offer more stable temperature control, making them particularly suitable for scenarios requiring prolonged high-load operation. We also support full custom transitions from air cooling to liquid cooling, including extruded aluminum heat sinks, heat pipe assemblies, and more.