PRODUCT DESIGN

Aluminum Zipper Fin Soldering Heatsink

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작성자 최고관리자 작성일 23-12-08 14:02

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The heatsink contains an aluminum stamping zipper fin and a copper vapor chamber, it is for telecom device application.

Stamping fin heatsink can offer a thermal performance improvement of up to 20% compared with typical aluminum or copper base spreaders particularly in applications like electronics or computers, where the heat source is small relative to the area for fins.